Encapsulation of implantable integrated MEMS pressure sensors using polyimide epoxy composite and atomic layer deposition

Gembaczka, P. (Corresponding author); Görtz, M.; Celik, Y.; Jupe, A.; Stühlmeyer, M.; Goehlich, A.; Vogt, H.; Mokwa, Wilfried; Kraft, M.

Göttingen : Copernicus Publ. (2014)
Journal Article

In: Journal of sensors and sensor systems : JSSS
Volume: 3
Page(s)/Article-Nr.: 335-347

Institutions

• Chair of Materials in Electrical Engineering I and Institute of Materials in Electrical Engineering [611510]