Gold/tin soldering of flexible silicon chips onto polymer tapes
Hungar, Kaspar; Mokwa, Wilfried
Bristol : IOP Publ. (2008)
Journal Article
In: Journal of micromechanics and microengineering
Volume: 18
Issue: 6
Page(s)/Article-Nr.: 064002
Institutions
- Chair of Materials in Electrical Engineering I and Institute of Materials in Electrical Engineering [611510]
Identifier
- DOI: 10.1088/0960-1317/18/6/064002
- RWTH PUBLICATIONS: RWTH-CONV-060159