Biocompatible assembling and packaging technology demonstrated by the integration of a micro sensor on a micro blood pump

Spanier, G.; Eberhardt, W.; Ahrendt, D.; Oprea, M.; Zippmann, V.; Legewie, F.; Mokwa, Wilfried; Kück, H.

Piscataway, NJ : IEEE Operations Center (2003)
Contribution to a book, Contribution to a conference proceedings

In: Proceedings of IEEE sensors 2003 : Second IEEE International Conference on Sensors, October 22 - 24, 2003, Sheraton Centre Hotel, Toronto, Canada / sponsored by the IEEE Sensors Council. - Vol. 2
Page(s)/Article-Nr.: 991-995

Institutions

• Chair of Materials in Electrical Engineering I and Institute of Materials in Electrical Engineering [611510]